Intel BX80570E8200A Datový list stáhnout pdf (Strana 103)

Case Temperature Reference Metrology

Thermal and Mechanical Design Guidelines 103

Figure 7-35. Removing Excess Adhesive from IHS

33. Using a blade, carefully shave any adhesive that is above the IHS surface

(Figure

7-35). The preferred method is to shave from the edge to the center of the

IHS.

Note: The adhesive shaving step should be performed while the adhesive is partially cured,

but still soft. This will help to keep the adhesive surface flat and smooth with no pits

or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a

second time.

34. Clean IHS surface with IPA and a wipe.

35. Clean the LGA pads with IPA and a wipe.

36. Replace the land side cover on the device.

37. Perform a final continuity test.

38. Wind the thermocouple wire into loops and secure or if provided by the vendor

back onto the plastic roll. (Figure

7-36).

Figure

7-36. Finished Thermocouple Installation

39. Place the device in a tray or bag until it’s ready to be used for thermal testing use.

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Intel BX80570E8200A Datový list Strana 103