Intel BX80570E8200A manuály

Intel BX80570E8200A Datový list (128 strany)

Značka: Intel | Kategorie: Procesory | Velikost: 3.30 MB |

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Tabulka s obsahem

Contents

3

Figures

6

Revision History

9

1 Introduction

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1.1.3 Document Scope

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1.2 References

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1.3 Definition of Terms

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 measurements

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Information

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2.1.2 Heatsink Attach

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2.2 Thermal Requirements

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2.2.2 Thermal Profile

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2.2.4 T

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7, Intel

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2.3.4 and

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2.3.1 Heatsink Size

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2.3.2 Heatsink Mass

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2.3.3 Package IHS Flatness

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2.4.3 Summary

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3 Thermal Metrology

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3.1.1 Example

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Assessment

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Guidelines

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3-3. The

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Thermal Metrology

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Thermal Monitor Feature

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4.2.1 PROCHOT# Signal

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4.2.3 Thermal Monitor 2

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4.2.5 On-Demand Mode

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4.2.6 System Considerations

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Considerations

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4.2.8 THERMTRIP# Signal

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7 and the Intel

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(BTX) Thermal/Mechanical

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Design Information

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5.1.2 Acoustics

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5.1.3 Effective Fan Curve

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Airflow (cfm)

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5.1.5 Altitude

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5-2. Random Vibration PSD

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5.2.2 Power Cycling

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5.4 Safety Requirements

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Thermal Module Assembly

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Detail A

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Detail B

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6 ATX Thermal/Mechanical

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Appendix H

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6.2.1 Heatsink Performance

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6.2.2 Acoustics

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6.2.3 Altitude

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3.3 and 6.6)

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6-3. Random Vibration PSD

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6.3.2 Power Cycling

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6.5 Safety Requirements

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Thermal Mechanical Design

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Less curvature in

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Shock Load

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Core shoulder

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7 Intel

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Quiet System

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Technology (Intel

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7-1. Intel

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RPM Temperature

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7-3 and listed below:

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7-3. Intel

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7.3 Intel

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A.3.1, and A.3.2

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Metrology

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B.1 Overview

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B.2 Test Preparation

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Heatsink Clip Load Metrology

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Load Cells (3x)

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Preload Fixture (copper

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B.3 Test Procedure Examples

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Measurement

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Appendix C Thermal Interface

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Management

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C.1 Bond Line Management

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C.2 Interface Material Area

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Thermal Interface Management

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Appendix D Case Temperature

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Reference Metrology

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D.1 Objective and Scope

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7-11. Order

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7-11. Omega Thermocouple

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D.4 IHS Groove

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7-14 for the 775-Land

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D.2 and D.3

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7-16)

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7-17)

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7-19-A and B)

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TC Wire with Insulation

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IHS with Groove

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7-24)

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7-25)

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7-25. Cutting Solder

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7-26)

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D.5.3 Solder Process

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7-27. Solder Station Setup

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7-28 and Figure 7-29)

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Installation

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7-32)

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7-33)

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7-34)

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7-36)

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Extended (BTX) System

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Thermal Considerations

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Thermal

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MCH Heatsink

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Reference Design

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BOARD PRIMARY SIDE

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BOARD SECONDARY SIDE

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Mechanical Drawings

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Figure 7-54. Intel

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Appendix H Intel

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Enabled Reference

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Solution Information

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