Intel T1700 Datový list stáhnout pdf (Strana 33)

Datasheet 33

Package Mechanical Specifications and Pin Information

4 Package Mechanical

Specifications and Pin

Information

4.1 Package Mechanical Specifications

The processor is available in a 1-MB, 478-pin Micro-FCPGA package. The package

mechanical dimensions, keep-out zones, processor mass specifications, and package

loading specifications are shown in Figure 3 through Figure 6.

The SFF processor (ULV DC) is available 956-ball Micro-FCBGA packages. The package

mechanical dimensions are shown in Figure 7.

The maximum outgoing co-planarity is 0.2 mm (8 mils) for SFF Package

The mechanical package pressure specifications are in a direction normal to the surface

of the processor. This requirement is to protect the processor die from fracture risk due

to uneven die pressure distribution under tilt, stack-up tolerances and other similar

conditions. These specifications assume that a mechanical attach is designed

specifically to load one type of processor.

Moreover, the processor package substrate should not be used as a mechanical

reference or load-bearing surface for the thermal or mechanical solution. Please refer

to the Santa Rosa Platform Mechanical Design Guide for more details.

Note: For M-step based processors refer to the 2-MB package drawings.

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Intel T1700 Datový list Strana 33