Intel AT80571AH0722ML Datový list stáhnout pdf (Strana 54)

ATX Thermal/Mechanical Design Information

54 Thermal and Mechanical Design Guidelines

6.2.2 Acoustics

To optimize acoustic emission by the fan heatsink assembly, the reference design

implements a variable speed fan. A variable speed fan allows higher thermal

performance at higher fan inlet temperatures (T

) and lower thermal performance with

improved acoustics at lower fan inlet temperatures. The required fan speed necessary

to meet thermal specifications can be controlled by the fan inlet temperature and

should comply with requirements in Table 6–2.

Table 6–2. Acoustic Results for ATX Reference Heatsink (E18764-001)

Fan

Speed

RPM

Thermist

or Set

Point

Acoustic Thermal Requirements,

ca Notes

3900

High

= 40 °C

5.0 BA

• 0.50° C/W (Core™2 Duo processor E8000 series 6

MB)

• 0.52° C/W (Core™2 Duo processor E7000 series 3

MB, Pentium dual-core processor E6000, E5000

series 2 MB, and Intel

Celeron

processor E3000

series with 1 MB)

2000

Low

= 30 °C

3.5 BA

• 0.65° C/W (Core™2 Duo processor E8000 series

with 6 MB)

• 0.68 °C/W (Core™2 Duo processor E7000 series 3

MB, Pentium dual-core processor E6000, E5000

series 2 MB, and Intel

Celeron

processor E3000

series with 1 MB)

Thermal Design

Power, Fan

speed limited

by the fan hub

thermistor

NOTES:

1. Acoustic performance is defined in terms of measured sound power (LwA) as defined in

ISO 9296 standard, and measured according to ISO 7779.

While the fan hub thermistor helps optimize acoustics at high processor workloads by

adapting the maximum fan speed to support the processor thermal profile, additional

acoustic improvements can be achieved at lower processor workload by using the

CONTROL

specifications described in Section 2.2.4. Intel recommendation is to use the

fan with 4 Wire PWM Controlled to implement fan speed control capability based

digital thermal sensor temperature. Refer to Chapter 7 for further details.

Note: Appendix F gives detailed fan performance for the Intel reference thermal solutions

with 4 Wire PWM Controlled fan.

6.2.3 Altitude

Many companies design products that must function reliably at high altitude, typically

1,500 m [5,000 ft] or more. Air-cooled temperature calculations and measurements at

the test site elevation must be adjusted to take into account altitude effects like

variation in air density and overall heat capacity. This often leads to some degradation

in thermal solution performance compared to what is obtained at sea level, with lower

fan performance and higher surface temperatures. The system designer needs to

account for altitude effects in the overall system thermal design to make sure that the

requirement for the processor is met at the targeted altitude.

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