Intel E8500 Uživatelský manuál Strana 10
- Strana / 54
- Tabulka s obsahem
- KNIHY
- E8500 Chipset North 1
- Bridge (XMB) 1
- Contents 3
- Revision History 6
- 1 Introduction 7
- 1.2 Definition of Terms 8
- 1.3 Reference Documents 9
- Introduction 10
- 2 Packaging Technology 11
- Packaging Technology 12
- 14 Intel 14
- 3 Thermal Specifications 15
- Thermal Specifications 16
- Table 3-2. Intel 16
- 4 Thermal Simulation 17
- Thermal Simulation 18
- 5 Thermal Metrology 19
- Thermal Metrology 20
- 5.2 Power Simulation Software 21
- 6.1 Operating Environment 23
- 6.2 Heatsink Performance 23
- 24 Intel 24
- Heatsink 25
- Motherboard 25
- TNB Location 26
- 4X Ø 2.95 ± 0.0254mm 26
- 4X Ø 5.5mm 26
- 6.5.1 Heatsink Orientation 27
- 28 Intel 28
- 6.6 Reliability Guidelines 29
- 30 Intel 30
- 7.1 Operating Environment 31
- 7.2 Heatsink Performance 31
- 32 Intel 32
- 34 Intel 34
- 7.6 Reliability Guidelines 35
- 36 Intel 36
- 8.1 Operating Environment 37
- 8.2 Heatsink Performance 37
- Heatsink Fin 38
- Heatsink Base 38
- XMB Location 39
- 40 Intel 40
- 8.6 Reliability Guidelines 41
- 42 Intel 42
- A Thermal Solution Component 43
- Suppliers 43
- 44 Intel 44
- 46 Intel 46
- B Mechanical Drawings 47
- Mechanical Drawings 48
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